Steve at Gamers Nexus recently got the chance to go hands-on with a delidded AMD Ryzen 7000 Desktop CPU.
AMD Ryzen 7000 CPU Delidding Unveils Gold-Plated IHS & Zen 4 CCDs With High-Quality TIM
The CPU that was removed is part of the Ryzen 9 family because it has two dies and we know that the dual CCD configuration only applies to the Ryzen 9 7950X and the Ryzen 9 7900X. The chip has a total of three dies, two of which are the aforementioned AMD Zen 4 CCDs fabricated on the 5nm process node and then we have the bigger one around the center, the IOD, which is based on a 6nm process node. The AMD Ryzen 7000 CCD measures with a die size of 70mm2 compared to 83mm2 for Zen 3 and has a total of 6.57 billion transistors, a 58% increase over the Zen 3 CCD with 4.15 billion transistors,
Scattered around the package are several SMDs (capacitors/resistors) that usually sit below the package substrate when we consider Intel’s CPUs. AMD instead puts them on the top tier and as such they had to design a new kind of IHS internally called the Octopus. We’ve seen the delidded IHS before, but now we get to see a final production chip with no lid to cover those gold Zen 4 nuggets!
That said, the IHS is an interesting part of the AMD Ryzen 7000 desktop CPUs. One photo shows the arrangement of the 8 arms that Robert Hallock ‘Director of Technical Marketing at AMD’ calls the ‘Octopus’. Each arm has a small application of TIM underneath which is used to solder the IHS to the interposer. Now it becomes very difficult to remove the chip as each arm is right next to the huge array of capacitors. Each arm is also raised slightly to make room for the SMDs and users don’t have to worry about heat getting trapped underneath.
AMD Ryzen 7000 Desktop CPU Delidded (Image Credits: GamersNexus):
Der8auer has also made a statement to Gamers Nexus regarding his upcoming delidding kit for AMD Ryzen 7000 Desktop CPUs that is in the works and he also seems to explain why the new CPUs have gold-plated CCDs:
As for the gold coating, there is the aspect that you can solder indium to gold without the need for flux. This makes the process easier and you don’t need harsh chemicals on your CPU. Without the gold coating it would theoretically also work to solder the silicon to copper, but it would be more difficult and you would need the flux to break the oxide layers.
Der8auer to GamersNexus
The most interesting area of the AMD Ryzen 7000 Desktop CPU IHS, besides the arms, is the gold-plated IHS which is used to increase the thermal dissipation from the CPU/IO chips and directly to the IHS. The two 5nm Zen 4 CCDs and the single 6nm IO die have liquid metal TIM or thermal interface material for better heat conduction and the aforementioned gold plating helps greatly with heat dissipation. What remains to be seen is whether the capacitors will have a silicone coating or not, but from the previous package shot it looks like they will.
It is also reported that the smaller footprint of the IHS means it will be more compatible with existing round and square cold plate coolers. Square cold plates are preferred, but round plates will work just fine too. Noctua has also pointed to the TIM application method and they suggest that users use the single-dot pattern in the middle of the IHS for AMD AM5 CPUs.
AMD Ryzen 7000 Desktop CPU Render (with/without IHS):
Another thing to note is that each Zen 4 CCD sits very close to the edge of the IHS, which wasn’t necessarily the case with previous Zen CPUs. So not only deliding will be very difficult, but the center is usually the IO die, which means that cooling equipment must be ready for such chips. The AMD Ryzen 7000 Desktop CPUs will launch in the fall of 2022 on the AM5 platform. That’s a chip that can reach up to 5.85GHz with a package power of up to 230W, so any small amount of cooling is a must for overclockers and enthusiasts.
AMD Mainstream Desktop CPU Generations Comparison:
|AMD CPU Family||Code name||Processor Process||Processors Cores/Wires (Max)||TDPs (max.)||Platform||Platform chipset||Memory support||PCIe support||launch|
|Ryzen 1000||Top Ridge||14nm (Zen1)||8/16||95W||AM4||300 series||DDR4-2677||Gen 3.0||2017|
|Ryzen 2000||Pinnacle Ridge||12nm (Zen+)||8/16||105W||AM4||400 series||DDR4-2933||Gen 3.0||2018|
|Ryzen 3000||Matisse||7nm (Zen 2)||16/32||105W||AM4||500 series||DDR4-3200||Gen 4.0||2019|
|Ryzen 5000||Vermeer||7nm (Zen3)||16/32||105W||AM4||500 series||DDR4-3200||Gen 4.0||2020|
|Ryzen 5000 3D||warhol?||7nm (Zen 3D)||8/16||105W||AM4||500 series||DDR4-3200||Gen 4.0||2022|
|Ryzen 7000||Raphael||5nm (Zen4)||16/32||170W||AM5||600 series||DDR5-5200||Gen 5.0||2022|
|Ryzen 7000 3D||Raphael||5nm (Zen4)||16/32?||105-170W||AM5||600 series||DDR5-5200/5600?||Gen 5.0||2023|
|Ryzen 8000||granite edge||3nm (Zen5)?||Not yet known||Not yet known||AM5||700 series?||DDR5-5600+||Gen 5.0||2024-2025?|